MEMS/MOEMS Packaging - Concepts, Designs, Materials, and Processes - K.B. Gilleo

Examines the properties of the materials used in MEMS and MOEN assembly and evaluates them in terms of their routing, electrical performance, thermal management and reliability. This book discusses packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging.